By American Society of Mechanical Engineers. Applied Mechanics Division.; et al
Read or Download Mechanics and materials for electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 PDF
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Extra resources for Mechanics and materials for electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
1027-1037, 2006.  G. H. Tian, P. Zhang , X. L. Li, J. Q. Yin, F. Lu, " Research on One Class of Optimization Problem of the Automated Warehouse Using a New Kind of Hybrid Genetic Algorithm, " System Simulation,16 (6), pp. 1198-1201,2004.  G. Q. Yin, F. Y. He, D. F. 347-350, June, 2006.  J. M. Xiao, J. J. Li, X. H. Wang. “A Modified Particle Swarm Optimization for Traveling Salesman Problems”, Computer Engineering and Applications, 35, pp. 50-52, 2005.  SUK-HWA CHANG and PIUS J. EGBELU.
When the basis weight is same, the hardwood pulp sheet’s elastic modulus is the biggest. 3. 3. 3. 3, for bamboo pulp sheet and softwood pulp sheet, the elastic modulus will improve with the content of PAM enhance firstly, and when arrive the peak value, the elastic modulus will decline. It because appropriate amount PAM will improve the fiber bonding strength especially for shear bonding strength, when adding too much, the PAM will flocculate. 2. 1. Beating degree The yield strength is defined as the stress at which a predetermined amount of permanent deformation occurs.
2. 1. 1. Raw materials Un-bleached Kraft hardwood pulp, Kraft softwood pulp and Kraft bleached bamboo pulp were the raw material and PAM was used in the experiments. 2. Instruments Mark_V1 PFI beater, Hamjern Maskin 621 beater, paper sheet former, digital INSTRON 5566 stress-strain measuring equipment, J-DHY03A thickness measurer and beating degree measurer. 2. Experiments procedure The three kinds of pulp board were dipped into water and beat with PFI beater and Hamjern Maskin 621 beater, the PAM was added into the pulp, then the beating degree was measured, then the pulp was formed to sheet and the wet sheet was pressed at 9 bar pressure.
Mechanics and materials for electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 by American Society of Mechanical Engineers. Applied Mechanics Division.; et al